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description this family of t-1 lamps is widely used in general purpose indicator applications. difu s ants, tints, and optical design are balanced to yield superior light output and wide view - ing angles. several intensity choices are available in each color for increased design fexibility. hlmp-1301, hlmp-1401, hlmp-1503, hlmp-k401, hlmp-k600 t-1 (3 mm) difused led lamps data sheet package dimensions features ?? ? high intensity ?? ? choice of 4 bright colors high efciency red orange yellow high performance green ?? ? popular t-1 diameter package ?? ? selected minimum intensities ?? ? wide viewing angle ?? ? general purpose leads ?? ? reliable and rugged ?? ? available on tape and reel
selection guide material color part number luminous intensity iv (mcd) at 10 ma min. max. gaasp on gap red hlmp-1301 3.4 C hlmp-1301-e00xx 3.4 C hlmp-1301-fg0xx 5.4 17. hlmp-1301-g00xx 8.6 C hlmp-1301-gh0xx 8.6 7.6 yellow hlmp-1401 . C hlmp-1401-d00xx 3.6 C hlmp-1401-e00xx 5.7 C hlmp-1401-ef0xx 5.7 18.4 hlmp-1401-efbxx 5.7 18.4 orange hlmp-k401 .1 C hlmp-k401-e00xx 3.4 C hlmp-k401-ef0xx 3.4 10.8 hlmp-k401-fgdxx 5.4 17. gap green hlmp-1503 1.0 C hlmp-1503-c00xx .6 C hlmp-1503-d00xx 4. C hlmp-1503-de0xx 4. 13.4 hlmp-1503-dedxx 4. 13.4 emerald green [1] hlmp-k600 1.0 C note: 1. please refer to application note 1061 for information comparing standard green and emerald green light output degradation.
3 part numbering system hlmp ? x x xx - x x x xx mechani c al o ption 00: bulk 01: t ape & r ee l , c r imped l eads 02, bx: t ape & r ee l , st r aig h t l eads a1: r ig h t angle housin g , une v en l eads a2: r ig h t angle housin g , e v en l eads d x, ee: ammo p ac k , st r aig h t l eads r4: t ape & r ee l , c ou n t er cloc k wise vx: ammo p ac k , ho r i z o n tal l eads fg: p r odu c ts need i n v e n t o r y c o n t r ol f or c us t omer idi c olor bin o ptions 0: f ull c olor bin dist r ibution b: c olor bins 2 & 3 only d: c olor bins 4 & 5 only maximum i v bin o ptions 0: open (no max. limit) o thers: p lease r e f er t o the i v bin t able minimum i v bin o ptions p lease r e f er t o the i v bin t able c olor o ptions 3: g ap her 4: g ap y ell o w (e x c ept k4xx s e r ies) 5: g ap g r een 6: g ap eme r ald g r een p ac k age o ptions 1: t -1 (3 mm) k : t -1 (3 mm) o r ange (k4xx) or eme r ald g r een (k6xx)
4 absolute maximum ratings at t a = 25c parameter her/orange yellow green units peak forward current 90 60 90 ma average forward current [1] 5 0 5 ma dc current [] 30 0 30 a r everse voltage (ir = 100 a) 5 5 5 v transient forward current [4] (10 sec pulse) 500 500 500 ma led junction temperature 110 110 110 c operating temperature range -40 to +100 -40 to +100 - 0 to +100 c storage temperature range -40 to +100 -40 to +100 -40 to +100 c notes: 1. see figure 5 (her/orange), 10 (yellow), or 15 (green/emerald green) to establish pulsed operating conditions. . for red, orange, and green series derate linearly from 50c at 0.5 ma/c. for yellow series derate linearly from 50c at 0. ma/c. 3. for red, orange, and green series derate power linearly from 5c at 1.8 mw/c. for yellow series derate power linearly from 50c at 1.6 mw/c. 4. the transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the led die and wirebond. it is not recommended that the device be operated at peak currents beyond the peak forward current listed in the absolute maximum ratings.
5 electrical characteristics at t a = 25c symbol description device hlmp- min. typ. max. units test conditions 1 / included angle between half luminous intensity points all 60 deg. i f = 10 ma see note 1 l peak peak wavelength high efciency red 635 nm measurement at peak orange 600 yellow 583 green 565 emerald green 558 l d dominant wavelength high efciency red 66 nm see note orange 60 yellow 585 green 569 emerald green 560 dl 1 / spectral line halfwidth high efciency red 40 nm yellow 36 green 8 emerald green 4 t s speed of response high efciency red 90 ns orange 80 yellow 90 green 500 emerald green 3100 c capacitance high efciency red 11 pf v f = 0; orange 4 f = 1 mhz yellow 15 green 18 emerald green 35 r j-pin thermal resistance all 90 c/w junction to cathode lead v f forward voltage her/orange 1.5 1.9 .4 v i f = 10 ma yellow 1.5 .0 .4 green 1.5 .1 .7 emerald green .1 .7 v r reverse breakdown voltage all 5.0 v i r = 100 a h v luminous efcacy high efciency red 145 lumens see note 3 orange 380 watt yellow 500 green 595 emerald green 655 notes: 1. 1/ is the of-axis angle at which the luminous intensity is half the axial luminous intensity. . the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the single wavelength which defnes the color of the device. 3. radiant intensity, l e , in watts/steradian, may be found from the equation i e = i v / h v , where i v is the luminous intensity in candelas and h v is the luminous efcacy in lumens/watt.
6 figure 5. maximum tolerable peak current vs. pulse duration. (i dc max as per max ratings). figure 3. relative luminous intensity vs. dc forward current. figure 2. forward current vs. forward voltage characteristics. figure 4. relative efciency (luminous intensity per unit current) vs. peak led current. t-1 high efciency red, orange difused lamps figure 1. relative intensity vs. wavelength. orange high efficiency red wavelength ? nm relative intensity 1.0 0.5 0 500 550 600 650 700 750 yellow emerald green high performance green t a = 25 c algaas red figure 6. relative luminous intensity vs. angular displacement.
7 t-1 yellow difused lamps figure 10. maximum tolerable peak current vs. pulse duration. (i dc max as per max ratings). figure 7. forward current vs. forward voltage characteristics. figure 8. relative luminous intensity vs. forward current. figure 9. relative efciency (luminous intensity per unit current) vs. peak current. figure 11. relative luminous intensity vs. angular displacement.
8 t-1 green/emerald green difused lamps figure 13. relative luminous intensity vs. forward current. figure 12. forward current vs. forward voltage characteristics. figure 14. relative efciency (luminous inten - sity per unit vurrent) vs. peak led current. figure 15. maximum tolerable peak current vs. pulse duration. (i dc max as per max ratings). figure 16. relative luminous intensity vs. angular displacement.
9 intensity bin limits color intensity range (mcd) bin min. max. d .4 3.8 e 3.8 6.1 f 6.1 9.7 g 9.7 15.5 h 15.5 4.8 i 4.8 39.6 j 39.6 63.4 k 63.4 101.5 l 101.5 16.4 m 16.4 34.6 n 34.6 340.0 red/orange o 340.0 540.0 p 540.0 850.0 q 850.0 100.0 r 100.0 1700.0 s 1700.0 400.0 t 400.0 3400.0 u 3400.0 4900.0 v 4900.0 7100.0 w 7100.0 1000.0 x 1000.0 14800.0 y 14800.0 1400.0 z 1400.0 30900.0 c .5 4.0 d 4.0 6.5 e 6.5 10.3 f 10.3 16.6 g 16.6 6.5 h 6.5 4.3 i 4.3 67.7 j 67.7 108. k 108. 173. yellow l 173. 50.0 m 50.0 360.0 n 360.0 510.0 o 510.0 800.0 p 800.0 150.0 q 150.0 1800.0 r 1800.0 900.0 s 900.0 4700.0 t 4700.0 700.0 u 700.0 11700.0 v 11700.0 18000.0 w 18000.0 7000.0
10 intensity bin limits, continued intensity range (mcd) color bin min. max. a 1.1 1.8 b 1.8 .9 c .9 4.7 d 4.7 7.6 e 7.6 1.0 f 1.0 19.1 g 19.1 30.7 h 30.7 49.1 i 49.1 78.5 j 78.5 15.7 green/ k 15.7 01.1 emerald green l 01.1 89.0 m 89.0 417.0 n 417.0 680.0 o 680.0 1100.0 p 1100.0 1800.0 q 1800.0 700.0 r 700.0 4300.0 s 4300.0 6800.0 t 6800.0 10800.0 u 10800.0 16000.0 v 16000.0 5000.0 w 5000.0 40000.0 maximum tolerance for each bin limit is 18%.
11 color categories lambda (nm) c olor category # min. max. 9 5.5 555.5 emerald green 8 555.5 558.5 7 558.5 561.5 6 561.5 564.5 6 561.5 564.5 5 564.5 567.5 green 4 567.5 570.5 3 570.5 573.5 573.5 576.5 1 58.0 584.5 3 584.5 587.0 yellow 587.0 589.5 4 589.5 59.0 5 59.0 593.0 1 597.0 599.5 599.5 60.0 3 60.0 604.5 orange 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 tolerance for each bin limit is 0.5 nm.
1 mechanical option matrix mechanical option code defnition 00 bulk packaging, minimum increment 500 pcs/bag 01 tape & reel, crimped leads, minimum increment 1800 pcs/bag 0 tape & reel, straight leads, minimum increment 1800 pcs/bag a1 right angle housing, uneven leads, minimum increment 500 pcs/bag a right angle housing, even leads, minimum increment 500 pcs/bag bg tape & reel, straight leads in k increment bj tape & reel, straight leads in k increment dd ammo pack, straight leads in k increment dj ammo pack, straight leads in k increment ee ammo pack, straight leads in 5k increment r4 tape & reel, straight leads, counter clockwise, anode lead leaving the reel frst va ammo pack, horizontal leads in k increment vb ammo pack, horizontal leads in k increment fg inventory control for customer idi note: all categories are established for classifcation of products. products may not be available in all categories. please contact your local avago representative for further clarifcation/information.
precautions lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standof. ? recommended soldering conditions: wave soldering manual solder dipping pre-heat temperature 105 c max. C pre-heat time 30 sec max. C peak temperature 50 c max. 60 c max. dwell time 3 sec max. 5 sec max. ? wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profle to ensure the soldering profle used is always conforming to recommended soldering condition. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 5c, before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole sizes for led component leads: led component lead size diagonal plated through hole diameter 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.05 inch) 0.976 to 1.078 mm (0.038 to 0.04 inch) 0.508 x 0.508 mm (0.00x 0.00 inch) 0.718 mm (0.08 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) note: refer to application note an10 7 for more information on soldering led components. figure 17. recommended wave soldering profle. for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. obsoletes 5989-4252en av02-1555en - october 13, 2008 laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 0 10 20 30 50 100 150 200 250 30 40 50 time ? seconds temperature ? c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150c (100c pcb) solder wave temperature = 245c air knife air temperature = 390c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force.

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